熱管理行業相關書籍匯總，僅供參考！

目錄

01、國際信息工程先進技術譯叢：先進封裝材料

02、Advanced Thermal Management Materials

03、Advanced Materials for Thermal Management of Electronic Packaging

04、Thermal Management of Gallium Nitride Electronics

05、電子設備熱設計

06、Advanced Thermal Design of Electronic Equipment

07、印制電路板（PCB）熱設計

08、Thermal Management Handbook: For Electronic Assemblies

09、傳熱學：電力電子器件熱管理

10、微電子系統熱管理

11、Thermal Management of Microelectronic Equipment

12、集成電路熱管理：片上和系統級的監測及冷卻

13、Thermal Design of Liquid Cooled Microelectronic Equipment

14、電動汽車動力電池熱管理技術

15、中國新能源汽車熱管理技術發展

16、Heat Pipe Science and Technology

17、Handbook of Thermal Management of Engines

18、熱力學（第二版）

19、Thermal Sciences: An Introduction to Thermodynamics, Fluid Mechanics, and Heat Transfer

20、Fundamentals of Statistical and Thermal Physics

21、Thermodynamics and An Introduction To Thermostatistics

22、Fundamentals of thermodynamics

23、Incroperas Principles Of Heat And Mass Transfer

24、ANSYS Icepak電子散熱基礎教程

25、從零開始學散熱

作者：[美] 呂道強（Daniel Lu）, 汪正平（C.P.Wong）編，陳明祥，尚金堂 譯

《國際信息工程先進技術譯叢：先進封裝材料》綜述了先進封裝技術的發展，包括三維（3D）封裝、納米封裝、生物醫學封裝等新興技術，并重點介紹了封裝材料與工藝方面的進展。本書適合微電子、集成電路制造行業的工程技術人員閱讀使用，也可作為高等院校相關的研究生和教師的參考用書。

作者：Guosheng Jiang, Liyong Diao, Ken Kuang

《Advanced Thermal Management Materials》provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

作者：[美] Xingcun Colin Tong（仝興存），安兵，呂衛文，吳懿平 譯

《Advanced Materials for Thermal Management of Electronic Packaging》，Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites. Provides the reader with a comprehensive understanding of thermal management solutions. Includes fundamentals of heat transfer and materials characterization techniques.

作者：Marko Tadjer, Travis Anderson

《Thermal Management of Gallium Nitride Electronics》outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs.

作者：趙惇殳

作者：Ralph Remsburg

《Advanced Thermal Design of Electronic Equipment》The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther-mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat-ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli-cation of advanced thermal management techniques requires a background in fluid dynamics.

作者：黃智偉 等

《印制電路板（PCB）熱設計》，全書著重介紹了PCB熱設計基礎、元器件封裝的熱特性與PCB熱設計、高導熱PCB的熱特性、PCB散熱通孔（過孔）設計、PCB熱設計示例，以及PCB用散熱器。本書內容豐富，敘述詳盡清晰，圖文并茂，通過大量的設計示例說明PCB熱設計中的一些技巧與方法及應該注意的問題，實用性強。

作者：Jerry E. Sergent, Al Krum

《Thermal Management Handbook: For Electronic Assemblies》In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage and preventing thermal-related problems from occurring in the first place.

作者：[美] Younes Shabany 著 , 余小玲，吳偉烽，劉飛龍 譯

作者：Lian-Tuu Yeh

《Thermal Management of Microelectronic Equipment》Electronics are the heart of any modern equipment. Thermal control of electronic equipment has long been one of the major areas of application of heat transfer technologies. Many improvements in reliability, power density, and physical miniaturization of electronic equipment over the years can be attributed in part to improved thermal analysis and design of systems. Improved thermal design has been made possible through advances in heat transfer technologies as well as computational methods and tools. The primary function of cooling systems for electronic equipment is to provide an acceptable thermal environment in which the equipment can operate. 

作者：[美] Seda Ogrenci-Memik 著，朱芳波，郭廣亮，舒濤 譯

《集成電路熱管理：片上和系統級的監測及冷卻》著重講述了集成電路熱管理部分的片上和系統級的監測及冷卻，內容包括：集成電路和系統熱設計的挑戰以及芯片發熱原理；芯片內置溫度傳感器的分類、構造、工作原理和設計挑戰，基于芯片內置溫度傳感器的動態熱管理方法和控制原理；針對集成電路和IC芯片的主動冷卻措施、工作原理，并重點介紹了空氣冷卻、液體冷卻、TEC熱電制冷以及相變冷卻技術；系統層以及數據中心層面的熱事件緩解措施與方法，著重介紹了數據中心內設備的工作負載均衡技術以及熱感知、熱管理技術；片上和系統級的溫度檢測新發展趨勢。本書內容豐富、涉及的專業知識面廣，適合于從事熱設計、熱管理領域的從業人員，以及電子工程師、集成電路設計工程師，以及高等院校相關專業師生閱讀。（英文名稱：Heat management in integrated circuits: On-chip and system-level monitoring and cooling）

作者：Lian-Tuu Yeh

《Thermal Design of Liquid Cooled Microelectronic Equipment》This book places a great deal of emphasis on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analog devices. This book provides a comprehensive review and overview of all liquid cooling technologies as well as their applications to commercial products in industry. To facilitate design and analysis, the most commonly used correlations for the friction factor and heat transfer coefficient with either single phase liquid or two phase flow are summarized in the book. The general guidelines for thermal design of liquid cooled systems along with a step-by-step thermal analysis and design procedure are presented for liquid cooled systems with or without boiling. To meet the needs in telecommunication industry in which no liquid cooled rack is currently available commercially, a detailed system thermal design of liquid cooled telecommunication equipment is made, and two thermal design options based on open loop and closed loop cooling schemes, respectively are presented. Furthermore, the cooling solutions and design procedures discussed here can readily and easily be applied to any systems in other industries.

作者：[加] Ibrahim Dincer 等 著，雍安姣 等 譯

《電動汽車動力電池熱管理技術》首先介紹了電動汽車及其結構，以及一定背景信息下所使用的動力電池，然后詳細介紹了各種傳統和*先進的電動汽車動力電池熱管理系統（包括相變材料）目前正在使用或可能建議在工業中使用的材料。在接下來的章節，為讀者提供了工具、方法和程序，以便在各種操作條件下為電池應用選擇/開發正確的熱管理設計、配置和參數，并指導讀者設置儀器和操作熱管理系統，以有效、成本效益高和環境友好的方式進行效能、經濟和環境分析。此外，對當前的技術問題和局限性進行了進一步的解析，分析了決定這些技術能否成功和廣泛采用的更微妙的因素，并且詳細闡述了在不久的將來電動汽車的技術發展趨勢以及兼容的熱管理系統。*后，給出了在實際應用中的各種案例。這些案例使用了貫穿全書的工具、方法和程序，以進一步說明它們在電動汽車電池熱管理系統的設計、開發和優化方面的功效。

作者：中國制冷學會，中國汽車工程學會 編

《中國新能源汽車熱管理技術發展》本書總結我國“碳達峰”“碳中和”背景下新能源汽車熱管理技術發展，詳細介紹了新能源汽車的發展現狀及其對熱管理的需求、新能源汽車熱管理技術實現形式、主要零部件現狀及其發展趨勢、制冷劑與載冷劑；并針對目前市場上典型的新能源乘用車、客車、卡車熱管系統進行總結介紹；后基于當前市場形勢總結我國新能源汽車熱管理技術將向著綠色高效化、功能一體化、結構模塊化、控制智能化方向發展，并給出了發展建議，以期促進我國新能源汽車熱管理技術的發展和產業升級，助力我國實現“雙碳”目標。本書適合高校、科研院所及企業從事新能源汽車熱管理研究的相關人員參考使用。

《Heat Pipe Science and Technology》Written to cover simple, intermediate, and advanced approaches to the theoretical and experimental analysis of heat pipes, this second edition emphasizes the physics and mathematics of heat pipes as well as the related technological and experimental issues. Reflecting the advancements in heat pipe science and technology, while still adhering to the fundamental principles, this second edition covers topics such as: Basic principles and applications of heat pipes, Solid-liquid-vapor phenomena in heat pipes, Steady-state characteristics of heat pipes, Heat transport limitations of heat pipes, Transient and frozen startup of heat pipes, Two-phase closed thermosyphons, Rotating and revolving heat pipes, Variable conductance heat pipes, Loop heat pipes and capillary pumped loops, Micro and miniature heat pipes, Pulsating and oscillating heat pipes, Heat pipe heat exchangers and heat sinks, Nonconventional heat pipes, Special effects in heat pipes, Heat pipe design, testing, and manufacturing.

作者：P. A. Lakshminarayanan, Avinash Kumar Agarwal

《Handbook of Thermal Management of Engines》This handbook deals with the vast subject of thermal management of engines and vehicles by applying the state of the art research to diesel and natural gas engines. The contributions from global experts focus on management, generation, and retention of heat in after-treatment and exhaust systems for light-off of NOx, PM, and PN catalysts during cold start and city cycles as well as operation at ultralow temperatures. This book will be of great interest to those in academia and industry involved in the design and development of advanced diesel and CNG engines satisfying the current and future emission standards.

作者：王竹溪

《熱力學（第二版）》是熱力學經典著作，包含熱力學理論的經典內容，如溫度、熱力學定律、熱力學第二定律、單元系的復相平衡、熱力學第三定律等，也包含了一些專題研究，如化學熱力學、溶液理論、重力場及彈性固體、不可逆過程熱力學等，同時對熱力學的方法論也進行了論述。

作者：Merle C. Potter, Elaine P. Scott

《Thermal Sciences: An Introduction to Thermodynamics, Fluid Mechanics, and Heat Transfer》This book covers three key subjects: thermodynamics, fluid mechanics, and heat transfer. Taking a well-balanced approach, the authors clearly demonstrate the connections among the three interrelated subjects. Because of the consistent terminology and continuity, readers will find it easier to learn the three subjects. Instructors will also find it easier to refer to material covered earlier (e.g. thermodynamic laws as applied in fluid mechanics and heat transfer). The book has a design emphasis and provides the appropriate amount of material for non-mechanical engineering students. Addressing various levels of difficulty, the authors provide a wealth of examples and exercises, including synthesis problems and design problems.

作者：Frederick Reif

《Fundamentals of Statistical and Thermal Physics》Reif first introduces basic probability concepts and statistical methods used throughout all of physics. Statistical ideas are then applied to systems of particles in equilibrium to enhance an understanding of the basic notions of statistical mechanics, from which derive the purely macroscopic general statements of thermodynamics. Next, he turns to the more complicated equilibrium situations, such as phase transformations and quantum gases, before discussing nonequilibrium situations in which he treats transport theory and dilute gases at varying levels of sophistication. In the last chapter, he addresses some general questions involving irreversible processes and fluctuations. A large amount of material is presented to facilitate students later access to more advanced works, to allow those with higher levels of curiosity to read beyond the minimum given on a topic, and to enhance understanding by presenting several ways of looking at a particular question. Formatting within the text either signals material that instructors can assign at their own discretion or highlights important results for easy reference to them. Additionally, by solving many of the 230 problems contained in the text, students activate and embed their knowledge of the subject matter.

作者：Herbert B. Callen

《Thermodynamics and An Introduction To Thermostatistics》The only text to cover both thermodynamic and statistical mechanics--allowing students to fully master thermodynamics at the macroscopic level. Presents essential ideas on critical phenomena developed over the last decade in simple, qualitative terms. This new edition maintains the simple structure of the first and puts new emphasis on pedagogical considerations. Thermostatistics is incorporated into the text without eclipsing macroscopic thermodynamics, and is integrated into the conceptual framework of physical theory.

作者：Richard E. Sonntag, Claus Borgnakke

作者：Frank P. Incropera 等

《Incroperas Principles Of Heat And Mass Transfer》從傳熱學的一些基本概念和原理入手，深入討論了熱傳導、對流和輻射的基本原理，其中還包括對流傳質與擴散傳質的一些內容。文中穿插了典型例題，并給出了詳細的解析。每章末附有大量實用的習題，供讀者練習。全書最后附有物質的熱物性等數據，以方便讀者查閱。全書語言流暢，圖文并茂，論理清楚，實用性強，是一本傳熱和傳質學方面不可多得的經典教材。本書還配有習題集，給出了重要習題的詳細解答步驟，可供參考使用。（《傳熱和傳質基本原理（原著第6版）》）

作者：王永康，張潔，張宇，耿麗麗

《ANSYS Icepak電子散熱基礎教程》本書將電子散熱設計分析的基本概念與ANSYS Icepak熱仿真實際案例緊密結合，對ANSYS Icepak的基礎操作進行了系統的講解說明，通過大量原創的分析案例，向讀者全面介紹ANSYS Icepak電子散熱分析模擬的方法、步驟。全書共10章，詳細講解了ANSYS Icepak的技術特征、ANSYS Icepak建立熱仿真模型的方法、ANSYS Icepak的網格劃分、ANSYS Icepak熱模擬的求解及后處理顯示、ANSYS Icepak常見技術專題案例、ANSYS Icepak宏命令Macros詳細講解等，并在部分章節列舉了相關案例。本書適合作為電子、信息、機械、力學等相關專業的研究生或本科生學習ANSYS Icepak的參考書，也非常適合從事電子散熱優化分析的工程技術人員學習參考。

作者：陳繼良

《從零開始學散熱》一書是從一名熱設計工程師具體技術工作層面出發，提出了一系列如何保證熱設計方案合理性的問題，并以一些實際的產品為例，進行了解釋說明。全書內容涉及電子產品熱設計的意義，熱設計理論基礎，熱設計研發流程，散熱方式的選擇，芯片封裝和電路板的熱特性，散熱器的設計，導熱界面材料的選型設計，風扇的選型設計，熱管和均溫板，熱電冷卻器、換熱器和機柜空調，液冷設計，熱設計中的噪聲，風扇調速策略的制定和驗證，熱測試，熱仿真軟件的功能、原理和使用方法，常見電子產品熱設計實例，熱、電、磁的結合等。本書詳細地記錄了一名熱設計工程師熱設計思維形成過程，希望能幫助讀者形成自己的設計思維，從而能夠應對任何從未遇到過的熱問題。本書適合電子產品熱設計工程師、電子設備熱設計從業人員、電子工程師、結構工程師，以及高等院校熱能與動力工程專業師生閱讀參考。

以上書籍僅供大家參考。