JESD51-全集與大家分享

在JEDEC網站上下載的關于thermal design部分的標準，有需要的朋友可以看看。

論壇有相關JEDEC標準，點擊下面標簽即可查看

標準系列：
JESD51: Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

JESD51-1: Integrated Circuit Thermal Measurement  Method—Electrical Test Method (Single Semiconductor Device)

JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions—Natural Convection (Still Air)

JESD51-3: Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-4: Thermal Test Chip Guideline (Wire Bond Type Chip)

JESD51-5: Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

JESD51-6: Integrated Circuit Thermal Test Method Environmental Conditions—Forced Convection (Moving Air)

JESD51-7: High Effective Thermal Conductivity Test Board for  Leaded Surface Mount Packages

JESD51-8: Integrated Circuit Thermal Test Method Environmental  Conditions—Junction-to-Board

JESD51-9: Test Boards for Area Array Surface Mount Package Thermal Measurements

JESD51-10: Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements.

JESD51-11Test Boards for Through-Hole Area Array Leaded
JEDEC51-12: Guidelines for Reporting and Using Electronic Package Thermal Information.

哥們，這也太多了，下載太麻煩，建議傳到一個免費的網絡硬盤上，再把地址發上來，比如納米盤

載來看看，謝謝共享。

好東西 謝謝分享

謝謝樓主,
分散了下載比較麻煩.

蒐集起來慢慢研究!!!感謝

謝謝樓主分享，大家共同進步。

hao dong xi a , xiexie la

感謝樓主分享，努力學習中

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